The conventional probabilistic approach to vibration and shock testing cannot pinpoint actual failure events. Instead of allowing for human interfaces when monitoring several key contributors to PCB functionality, Sherlock’s computerized modeling is based on the temperature map from the solder fatigue input, and uses board stackup to calculate barrel stress for finite test results and remedy. Faulty components and the number and type of failures are identified with certainty, allowing for a quicker, usually less costly fix to happen earlier in the process. Instead of applying and working within the parameters of traditional methods, Sherlock designs the board and applies the temperature cycle to it. Using Sherlock as part of your test plan significantly reduces the time and expense of multiple iterations of each qualification test, including: Align reliability goals with metrics and requirements.Engineers can design reliability right into electronics, allowing them to: Sherlock reduces the number of required physical testing iterations and improves the chances that prototypes will pass qualification tests in the first round. Semiconductor wear-out, which allows manufacturers to evaluate and predict IC failures using an approach that follows SAE ARP 6338.Post-assembly handling operations assessment to identify areas for efficiency improvement after production.Supplier analysis for building partnerships that can consistently deliver quality products and services without interruption.Material selection to align a plastic’s properties with design and functionality requirements.Strain measurement during shock and vibration testing to gather data for prediction of failure probability, root causes of failure and failure events.Plated through-hole fatigue by using computerized modeling and temperature maps instead of human interfaces for accurate finite element test results.Solder joint reliability to assure a product will function under given conditions, for a specified time, without exceeding defined failure levels.To maximize Design for Manufacturability (DfM) and Design for Reliability (DfR) in order to mitigate risk, Sherlock evaluates key components, including: Design rework is accomplished within minutes, not weeks or months. Sherlock automates the process, reduces required resources and provides results quicker.
Near real-time production of custom reports (up to 100+ pages per PCB), plus dataset and image export capabilities.FEA calculations analysis for reliability predictions for all parts using validated models.Automatic adjustment for materials, stackups and lifecycle events (thermal, shock and vibration).Simultaneous application of multiple environmental influences to test within specific parameters.Automatic ECAD data import, generation of 3D models and assignment of properties to 3D objects.Lead Modeling: Sherlock enables the addition of through-hole leads to select components and the viewing of virtually constructed PCBs in 3D.PCB Meshing: Sherlock identifies homogeneous mechanical properties of the uniform (whole) model and those of each layer in a layered model.High Fidelity PCBs: Sherlock identifies mesh copper features within PCB substrate materials to identify potential risks.Stackup: Sherlock allows for accurate selection of glass and fiber, informing the overall material properties selection.Design Failure Mode and Effects Analysis (DFMEA).Sherlock also accelerates traditional design for reliability activities, including: Reliability predictions not previously possible.Post-processing of finite element simulations to identify critical components and predict time to failure.3D models of electronic assemblies for early analysis.Teams can use Sherlock to integrate design rules, best practices and Physics of Failure (PoF) methods, including Electrical and mechanical engineers can work in tandem using Sherlock to Design for Reliability from the start of the project.